@InProceedings{IPC2019,
  author    = {Mali{\'{n}}ski, Kamil and Okarma, Krzysztof},
  title     = {A Simplified Classification of Electronic Integrated Circuits Packages Based on Shape Descriptors},
  booktitle = {Image Processing and Communications},
  year      = {2020},
  editor    = {Chora{\'{s}}, Micha{\l} and Chora{\'{s}}, Ryszard S.},
  volume    = {1062},
  series    = {Advances in Intelligent Systems and Computing},
  pages     = {125--133},
  address   = {Cham},
  publisher = {Springer International Publishing},
  abstract  = {Automatic classification of electronic elements based on image analysis may be useful for verification of a proper selection of electronic integrated circuits previously assembled in the Printed Circuit Boards (PCBs), as well as for an automated sorting of such elements in robotic systems supporting their production. Although modern high speed pick and place machines dedicated for small surface-mount devices (SMD), utilising very small packages, largely replaced the through-hole assembling technology in many industrial application, there are still some types of applications where such technology is less suitable, e.g. due to thermal, mechanical or power constraints. Hence, a proper classification of electronic elements in dual in-line packages (DIP) using shape analysis may be an important element for the combination with further steps based on the recognition of alphanumerical markings. Some experimental results obtained for selected shape descriptions are presented in this paper, which are promising also for natural images.},
  doi       = {10.1007/978-3-030-31254-1_16},
  isbn      = {978-3-030-31254-1},
}